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Chip Dielectric Filters TDF Series TDF series for Wireless LAN SELECTION GUIDE FOR STANDARD DEVICES * The Part Numbers shown in the table below are standard devices, which are readily available. TOKO will design and manufacture modified and custom devices with specific characteristics to meet your requirements. If you do not find the device for your application in this catalog, please contact our sales or representative office. * RoHS compliant * * TOKO Part Number Center Insertion V.S.W.R. Bandwidth Frequency Loss in BW (MHz) (MHz) (dB) Max. Max. 2450.0 2450.0 2450.0 2450.0 2450.0 2450.0 2484.0 2484.0 2484.0 2484.0 2546.0 2639.5 3449.75 3549.75 3960.0 4050.0 4995.0 4995.0 5075.0 5125.0 5250.0 5250.0 5250.0 5250.0 5375.0 5437.5 5500.0 5775.0 5775.0 Fo 50.0 Fo 50.0 Fo 50.0 Fo 50.0 Fo 50.0 Fo 50.0 Fo 13.0 Fo 13.0 Fo 13.0 Fo 13.0 Fo 46.5 Fo 46.5 Fo 50.25 Fo 50.25 Fo 792 Fo 750 Fo 95.5 Fo 95.5 Fo 175.0 Fo 100.0 Fo 100.0 Fo 100.0 Fo 100.0 Fo 100.0 Fo 475.0 Fo 287.5 Fo 350.0 Fo 50.0 Fo 75.0 2.00 2.00 2.30 3.00 2.00 1.50 3.00 2.00 2.00 3.00 1.80 1.50 1.50 1.40 1.80 1.80 1.50 3.10 1.25 1.30 1.50 3.00 1.50 1.30 1.20 1.20 1.00 3.30 1.50 2.00 2.00 2.00 2.00 2.00 2.00 1.60 1.60 2.00 2.00 2.00 2.00 2.00 2.00 2.00 2.00 2.00 2.00 2.00 2.00 2.00 2.00 2.00 2.00 2.00 2.00 2.00 2.70 2.00 Selectivity (dB) Min. (MHz) Dimension (mm) W x L x T (Max.) Application 2.4G-LAN 2.4G-LAN 2.4G-LAN 2.4G-LAN 2.4G-LAN 2.4G-LAN 2.4G-LAN 2.4G-LAN 2.4G-LAN 2.4G-LAN MMDS MMDS Wi MAX Wi MAX UWB UWB 5G-LAN 5G-LAN 5G-LAN 5G-LAN 5G-LAN 5G-LAN 5G-LAN 5G-LAN 5G-LAN 5G-LAN 5G-LAN 5G-LAN 5G-LAN Pcs/Reel 2000 2000 1500 1500 2000 3000 2000 2000 2000 2000 2000 2000 2000 2000 2000 2000 2000 2000 2000 3000 2000 2000 2000 3000 2000 2000 2000 2000 2000 TDF2A-2450T-10A TDFM1A-2450T-10A TDFM1B-2450T-10A TDFM1C-2450T-10A TDFS8A-2450T-13A TDFU2A-2450T-10A TDF2A-2484E-11A TDF2A-2484E-12A TDFM1A-2484E-10A TDFM1A-2484E-11A TDFM1B-2546S-10A TDFM1B-2639S-10A TDFS1C-3449T-10A TDFM2A-3549T-10A TDFS1F-3960Z-10A TDFS1F-4050Z-10A-01 TDFM2A-4995X-10A-01 TDFM2C-4995X-10A TDFS8A-5075Z-10A TDFU2A-5125Z-10A TDFM2A-5250X-10A TDFM2C-5250X-10A TDFS8A-5250X-10A TDFU2A-5250X-10A TDFS8B-5375Z-10A TDFS8A-5437Z-10A TDFS8A-5500Z-10A TDFM2A-5775T-10A-01 TDFM2A-5775V-11A 20, 16 (Fo - 280, + 280) 5.7 x 5.1 x 2.25 20, 16 (Fo - 280, Fo + 280) 4.5 x 5.2 x 2.0 35, 30 (Fo - 430, + 350) 6.5 x 5.1 x 2.0 21, 32 (Fo 150, - 200) 9.0 x 5.15 x 2.0 40 (Fo - 500) 3.2 x 3.0 x 1.8 30 (1910~1990) 2.0 x 2.85 x 1.25 35, 30 (Fo 350, 700) 5.7 x 5.1 x 2.25 25, 30 (Fo 350, 700) 5.7 x 5.1 x 2.25 25, 30 (Fo 350, 700) 4.5 x 5.1 x 2.0 35, 30 (Fo 350, 700) 4.5 x 5.2 x 2.0 44, 40 (Fo 412.4, 868.5) 6.5 x 4.05 x 1.90 33, 35 (Fo 410.5, 866.5) 6.5 x 4.75 x 1.90 40, 45 (Fo - 862, - 406) 6.5 x 4.4 x 2.0 31, 33 (Fo - 882, - 406) 4.5 x 4.5 x 2.25 40, 30 (Fo - 1460, Fo + 1190) 8.5 x 3.5 x 1.9 40,30 (Fo - 1550, Fo + 1100) 8.5 x 3.4 x 1.9 20 (Fo - 795) 4.5 x 3.3 x 2.25 35, 50 (Fo - 560, Fo + 560) 9.0 x 3.3 x 2.25 20 (4200) 3.75 x 3.25 x 1.8 35 (3800) 2.4 x 2.15 x 1.25 20 (Fo - 800) 4.5 x 3.2 x 2.25 35 (Fo - 400) 9.0 x 3.1 x 2.25 20 (Fo - 800) 3.2 x 3.2 x 1.8 30 (Fo - 1710) 2.4 x 2.1 x 1.25 22 (Fo - 1475, Fo + 2025) 4.5 x 3.0 x 1.7 25 (Fo - 1937) 3.2 x 3.05 x 1.7 25 (3500) 3.2 x 3.05 x 1.8 28 (5225.0~5325.0) 4.5 x 2.9 x 2.25 7 (Fo - 425) 4.5 x 2.9 x 2.25 TDFU2A-5250X-10A Typical Characteristics TDFU2A-5250X-10A 0 10 20 0 5 Attenuation 10 15 20 Attenuation (dB) 30 40 50 60 70 80 1.4 OUT 0.5 2.4 1.25Max. 2.0 IN Return loss 25 30 35 40 45 50 2.1 KA GND 90 (Unit:mm) 100 Center Frequency :5,250MHz Span :4,000MHz Return Loss (dB) Chip Dielectric Filters TDF Series TDFS8A-5437Z-10A Typical Characteristics TDFS8A-5437Z-10A 0 10 3.2 1.7Max. 3.2 0 5 10 15 20 25 20 Attenuation (dB) 2.4 1.8 0.575 0.6 30 40 50 60 70 80 90 100 54A Attenuation Return loss 3.0 1.3 OUT 30 35 40 45 50 G 0.6 0.575 0.7 (Unit: mm) Center Frequency :5,437.5MHz Span :6,000MHz TDFM1B-2450T-10A Typical Characteristics TDFM1B-2450T-10A 0.8 1.2 G G 5.7 1.2 B2450-10 TOKO 1.0 OUT Attenuation Return loss 6.5 2.0Max. G 1.2 G 1.2 3.2 (Unit: mm) Center Frequency : 2,450MHz Span : 1,000MHz TDFU2A-2450T-10A Typical Characteristics TDFU2A-2450X-10A 0 10 20 0 5 Attenuation 10 15 20 25 Attenuation (dB) 2.0 1.25Max. 30 40 50 60 70 80 90 EA Return loss 30 35 40 45 50 GND 0.6 (Unit: mm) 100 Center Frequency :2,450MHz Span :2,000MHz Return Loss (dB) 1.5 0.9 IN 1.2 2.85 OUT Return Loss (dB) Attenuation (dB) IN 2.5 4.25 5.1 G Return Loss (dB) 0.7 IN ;;; ; ;;;;; ; ;;; ;;;;; ;; ;;; ; ;; ;; ;; ;; Series PART NUMBERING SYSTEM / Chip Dielectric Filters TDF ;; ;;; ;;; ;; ; ;; TDFS Type TDFM Type TDF Type TDFH Type T2 T3 T1 ;;; ; ; ;; TDFM 3 A 1907 E 10 A P Taping / Solder Plate Less / Specification Code / Bandwidth Code / Center Frequency / #Poles / Profile Code / TOKO's Type Name / DIMENSIONS / 2 Poles 3.2 L 4.5 T4 L 5.7 L 5.7 L T3 T1 T2 3 Poles 4.5 L 6.5 L 8.5 T4 L 8.5 L T3 T1 T2 4 Poles 6.5 L 9.0 L 11 T4 .5 11 .5 L L unit:mm T1 T2 T3 T4 2.25 Max. 2.0 Max. 1.8 Max. 2.8 Max. 2.25 Max. 2.0 Max. 3.0 Max. 2.25 Max. 2.0 Max. 5.5 Max. 4.0 Max. *The length, L, is different depending on the part number. Refer to the separate table. *For the details of shapes regarding individual part numbers, contact us separately Temperature profile (land seface temperature) ( ) for leaded process 230 210 190 180 150 260 240 220 180 150 for lead free process *1 Pre-heat conditions *1 150 160 60s. Max. Reflow conditions *2 160 Min. 45s. Max. *3 200 Min. 30s. Max. *4 2305 5s. Max. *4 *3 *2 *1 150 160 *2 160 *3 200 *4 2305 60 45 30 5 *1 Pre-heat conditions *1 150 180 120s. Max. Reflow conditions *2 180 Min. 150s. Max. *3 230 Min. 40s. Max. *4 2555 5s. Max. *4 *3 *2 *1 150 180 *2 180 *3 230 *4 2555 120 150 40 5 1. Reflow solder conditions *Solderability When flux-mounted terminals are immersed in solder at following conditions, at least 95% of the surface should be covered by solder. Conditins leaded process : 2305C for 30.5 seconds lead free process : 2605C for 30.5 seconds *Solder heat resistance No abnomalities under solder conditions of leaded process : 2305C for 5 seconds lead free process : 2605C for 5 seconds 2. Rinsing After Soldering, you should rinsing away the excess flux. Any commercially available rinsing agent may be used. 3. Other Precautions Perform soldering at as low a temperature as possible and for as short a time as possible. Make sure that the silver electrode of resonators is not covered by solder. Avoid applying external forces to terminals such as by bending or cutting them. 4. Iron Soldering Perform iron soldering with iron at following conditions. Conditins leaded process : 3505C for 5s. Max. lead free process : 3905C for 5s. Max. |
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